An alternative to conventional circuit boards for satellites, these 3D-molded interconnect devices add electrical connectivity to the surface of three-dimensional structures. @ESA_Tech #IOTW #electronics
Read more: https://t.co/RCM0bCG2Lj pic.twitter.com/AmcZp1Hypw— ESA (@esa) April 11, 2018
Previous Post: ESA on Twitter
Next Post: ESA space history on Twitter